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? 2002-2012 microchip technology inc. ds21421e-page 1 tc4423/tc4424/tc4425 features high peak output current: 3a wide input supply voltage operating range: - 4.5v to 18v high capacitive load drive capability: - 1800 pf in 25 ns short delay times: <40 ns (typ) matched rise/fall times low supply current: - with logic 1 input C 3.5 ma (max) - with logic 0 input C 350 a (max) low output impedance: 3.5 ? (typ) latch-up protected: will withstand 1.5a reverse current logic input will withstand negative swing up to 5v esd protected: 4 kv pin compatible with the tc1426/tc1427/tc1428, tc4426/tc4427/tc4428 and tc4426a/ tc4427a/tc4428a devices. space-saving 8-pin 6x5 dfn package applications switch mode power supplies pulse transformer drive line drivers general description the tc4423/tc4424/tc4425 devices are a family of 3a, dual-output buffers/mosfet drivers. pin compati- ble with the tc1426/27/28, tc4426/27/28 and tc4426a/27a/28a dual 1.5a driver families, the tc4423/24/25 family has an increased latch-up current rating of 1.5a, making them even more robust for operation in harsh electrical environments. as mosfet drivers, the tc4423/tc4424/tc4425 can easily charge 1800 pf gate capacitance in under 35 nsec, providing low enough impedances in both the on and off states to ensure the mosfet's intended state will not be affected, even by large transients. the tc4423/tc4424/tc4425 inputs may be driven directly from either ttl or cmos (2.4v to 18v). in addition, the 300 mv of built-in hysteresis provides noise immunity and allows the device to be driven from slowly rising or falling waveforms. package types (1) 8-pin dfn (2) nc in a gnd in b 23 4 5 6 7 8 1 8-pin pdip 12 3 4 nc 5 6 7 8 out a out b nc in a gnd in b v dd tc4423 tc4424 note 1: duplicate pins must both be connected for proper operation. 2: exposed pad of the dfn package is electrically isolated. tc4423 tc4424 ncout a out b v dd tc4423 tc4424 tc4425 ncout a out b v dd 12 3 4 5 6 7 8 1613 12 11 10 9 nc in a nc gndgnd nc in b nc nc out a v dd v dd out b out b nc out a 1514 tc4423 tc4424 tc4425 16-pin soic (wide) ncout a v dd v dd out bout b nc out a out a v dd v dd out b out b nc out a tc4423 tc4424 tc4425 nc tc4425 tc4425 ncout a out b v dd tc4423 tc4424 ncout a out b v dd tc4425 ncout a out b v dd 3a dual high-speed power mosfet drivers downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 2 ? 2002-2012 microchip technology inc. functional block diagram (1) effective input c = 20 pf (each input) tc4423 dual inverting tc4424 dual non-inverting tc4425 one inverting, one non-inverting output input gnd v dd 300 mv 4.7v inverting non-inverting note 1: unused inputs should be grounded. 750 a downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 3 tc4423/tc4424/tc4425 1.0 electrical characteristics absolute maximum ratings ? supply voltage ............................................... .................+22v input voltage, in a or in b ................................................ (v dd + 0.3v) to (gnd C 5v) package power dissipation (t a ?? 70c) dfn ......................................................................... note 2 pdip .......................................................................730 mw soic.......................................................................470 mw ? notice: stresses above those listed under "maximum ratings" may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. exposure to maximum rating conditions for extended periods may affect device reliability. dc characteristics electrical specifications: unless otherwise indicated, t a = +25c, with 4.5v ??? v dd ??? 18v. parameters sym min typ max units conditions input logic 1 , high input voltage v ih 2.4 v logic 0 , low input voltage v il 0 . 8v input current i in C1 1 a 0v ??? v in ??? v dd output high output voltage v oh v dd C 0.025 v low output voltage v ol 0.025 v output resistance, high r oh 2 . 85 ? i out = 10 ma, v dd = 18v output resistance, low r ol 3 . 55 ? i out = 10 ma, v dd = 18v peak output current i pk 3a latch-up protection with- stand reverse current i rev >1.5 a duty cycle ???? 2%, t ??? 300 sec. switching time (note 1) rise time t r 2 33 5n s figure 4-1 , figure 4-2 , c l = 1800 pf fall time t f 2 53 5n s figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d1 3 37 5n s figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d2 3 87 5n s figure 4-1 , figure 4-2 , c l = 1800 pf power supply power supply current i s 1.5 0.15 2.5 0.25 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. 2: package power dissipation is dependent on the copper pad area on the pcb. downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 4 ? 2002-2012 microchip technology inc. dc characteristics (over operating temperature range) temperature characteristics electrical specifications: unless otherwise indicated, operating temperature range with 4.5v ??? v dd ??? 18v. parameters sym min typ max units conditions input logic 1 , high input voltage v ih 2.4 v logic 0 , low input voltage v il 0 . 8v input current i in C10 +10 a 0v ??? v in ??? v dd output high output voltage v oh v dd C 0.025 v low output voltage v ol 0 . 0 2 5v output resistance, high r oh 3 . 78 ? i out = 10 ma, v dd = 18v output resistance, low r ol 4 . 38 ? i out = 10 ma, v dd = 18v peak output current i pk 3 . 0a latch-up protection withstand reverse current i rev >1.5 a duty cycle ???? 2%, t ??? 300 sec switching time (note 1) rise time t r 2 86 0n s figure 4-1 , figure 4-2 , c l = 1800 pf fall time t f 3 26 0n s figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d1 32 100 ns figure 4-1 , figure 4-2 , c l = 1800 pf delay time t d2 38 100 ns figure 4-1 , figure 4-2 , c l = 1800 pf power supply power supply current i s 2.0 0.2 3.5 0.3 ma v in = 3v (both inputs) v in = 0v (both inputs) note 1: switching times ensured by design. electrical specifications: unless otherwise noted, all parameters apply with 4.5v ? v dd ? 18v. parameters sym min typ max units conditions temperature ranges specified temperature range (c) t a 0+ 7 0 c specified temperature range (e) t a C40 +85 c specified temperature range (v) t a C40 +125 c maximum junction temperature t j + 1 5 0 c storage temperature range t a C65 +150 c package thermal resistances thermal resistance, 8l-6x5 dfn ? ja 33.2 c/w typical four-layer board with vias to ground plane thermal resistance, 8l-pdip ? ja 125 c/w thermal resistance, 16l-soic ? ja 155 c/w downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 5 tc4423/tc4424/tc4425 2.0 typical performance curves figure 2-1: rise time vs. supply voltage. figure 2-2: rise time vs. capacitive load. figure 2-3: rise and fall times vs. temperature. figure 2-4: fall time vs. supply voltage. figure 2-5: fall time vs. capacitive load. figure 2-6: propagation delay vs. input amplitude. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics lis ted herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 4681 01 21 41 61 8 2200 pf 100 8060 40 20 0 1000 pf 3300 pf 1500 pf 4700 pf 470 pf t rise (nsec) v dd (v) 100 1000 10,000 5v 10v 15v 100 8060 40 20 0 t rise (nsec) c load (pf) time (nsec) 3230 28 26 24 22 20 18 -55 -35 5 25 45 65 85 105 125 -15 t fall t rise t a ( c) t fall t rise c load = 2200 pf 4681 01 21 41 61 8 100 8060 40 20 0 1000 pf 1500 pf 4700 pf 3300 pf 2200 pf 470 pf t fall (nsec) v dd (v) 100 1000 10,000 5v 10v 15v 100 8060 40 20 0 t fall (nsec) c load (pf) 100 8060 40 20 delay time (nsec) input (v) 0123456789101112 t d1 t d2 c load = 2200 pf v dd = 10v downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 6 ? 2002-2012 microchip technology inc. typical performance curves (continued) figure 2-7: propagation delay time vs. supply voltage. figure 2-8: quiescent current vs. supply voltage. figure 2-9: output resistance (output high) vs. supply voltage. figure 2-10: propagation delay time vs. temperature. figure 2-11: quiescent current vs. temperature. figure 2-12: output resistance (output low) vs. supply voltage. 5045 40 35 30 25 20 4 6 8 1012141618 delay time (nsec) v dd (v) c load = 2200 pf t d1 t d2 1 0.1 0.01 4 6 8 10 12 14 16 18 both inputs = 1 both inputs = 0 v dd (v) i quiescent (ma) t a = 25 c 1412 10 86 4 2 4 6 8 10 12 14 16 18 typical @t a = +25 c worst case @ t j = +150 c v dd (v) r ds(on) ( ) 5045 40 35 30 25 20 delay time (nsec) -55 -35 -15 5 25 45 65 85 105 125 t d2 t d1 c load = 2200 pf t a ( c) -55 -35 -15 5 25 45 65 85 105 125 1.41.2 1.0 0.8 0.6 0.4 0.2 0.0 both inputs = 1 both inputs = 0 t a ( c) i quiescent (ma) 1412 10 86 4 2 4 6 8 1012141618 worst case @ t j = +150 c v dd (v) typical @t a = +25 c r ds(on) ( ) downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 7 tc4423/tc4424/tc4425 typical performance curves (continued) note : load on single output only figure 2-13: supply current vs. capacitive load. figure 2-14: supply current vs. capacitive load. figure 2-15: supply current vs. capacitive load. figure 2-16: supply current vs. frequency. figure 2-17: supply current vs. frequency. figure 2-18: supply current vs. frequency. 100 1000 10,000 6050 40 30 20 10 0 355 khz 200 khz 35.5 khz 634 khz c load (pf) 112.5 khz 20 khz 63.4 khz v dd = 18v i supply (ma) 100 1000 10,000 2 mhz 1.125 mhz 634 khz 355 khz 200 khz112.5 khz 63.4 khz 20 khz 9080 70 60 50 40 30 20 10 0 i supply (ma) c load (pf) v dd = 12v 100 1000 10,000 634 khz 355 khz 112.5 khz 20 khz 2 mhz 1.125 mhz 3.55 mhz 120100 8060 40 20 0 c load (pf) i supply (ma) v dd = 6v 10,000 pf frequency (khz) 6050 40 30 20 10 0 10 100 1000 3300 pf 100 pf 1000 pf i supply (ma) v dd = 18v 10,000 pf 10 100 1000 frequency (khz) 9080 70 60 50 40 30 20 10 0 100 pf 3300 pf 1000 pf i supply (ma) v dd = 12v 10 100 1000 frequency (khz) 1000 pf 4700 pf100 pf 120100 8060 40 20 0 10,000 pf 2200 pf i supply (ma) v dd = 6v downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 8 ? 2002-2012 microchip technology inc. typical performance curves (continued) figure 2-19: tc4423 crossover energy. 10 -8 8 10 -7 a ? sec 024681012141618 64 2 8 6 4 2 10 -9 v in (v) note: the values on this graph represent the loss seen by both drivers in a package during one complete cycle. for a single driver, divide the stated values by 2. for a single transition of a single driver, divide the stated value by 4. downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 9 tc4423/tc4424/tc4425 3.0 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table (1) 3.1 inputs a and b inputs a and b are ttl/cmos compatible inputs that control outputs a and b, respectively. these inputs have 300 mv of hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals, and to provide noise immunity. 3.2 outputs a and b outputs a and b are cmos push-pull outputs that are capable of sourcing and sinking 3a peaks of current (v dd = 18v). the low output impedance ensures the gate of the external mosfet will stay in the intended state even during large transients. these outputs also have a reverse current latch-up rating of 1.5a. 3.3 supply input (v dd ) v dd is the bias supply input for the mosfet driver and has a voltage range of 4.5v to 18v. this input must be decoupled to ground with a local ceramic capacitor. this bypass capacitor provides a localized low- impedance path for the peak currents that are to be provided to the load. 3.4 ground (gnd) ground is the device return pin. the ground pin(s) should have a low-impedance connection to the bias supply source return. high peak currents will flow out the ground pin(s) when the capacitive load is being discharged. 3.5 exposed metal pad the exposed metal pad of the 6x5 dfn package is not internally connected to any potential. therefore, this pad can be connected to a ground plane or other cop- per plane on a printed circuit board to aid in heat removal from the package. 8-pin pdip 8-pin dfn 16-pin soic (wide) symbol description 1 1 1 nc no connection 2 2 2 in a input a 3 nc no connection 3 3 4 gnd ground 5 gnd ground 6 nc no connection 4 4 7 in b input b 8 nc no connection 9 nc no connection 5 5 10 out b output b 1 1o u t b o u t p u t b 661 2v dd supply input 1 3v dd supply input 7 7 14 out a output a 15 out a output a 8 8 16 nc no connection pad nc exposed metal pad note 1: duplicate pins must be connected for proper operation. downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 10 ? 2002-2012 microchip technology inc. 4.0 applications information figure 4-1: inverting driver switching time. figure 4-2: non-inverting driver switching time. 0.1 f +5v 10% 90% 10% 90% 10% 90% 18v 1f wima mks-2 0v 0v tc4423 (1/2 tc4425) 1 2 c l = 1800 pf input input output t d1 t f t d2 input: 100 khz, square wave, output t r v dd = 18v t rise = t fall ?? 10 ns ceramic 90% input t d1 t f t d2 output t r 10% 10% 10% +5v 18v 0v 0v 90% 90% input: 100 khz, square wave, t rise = t fall ?? 10 ns 0.1 f 1f wima mks-2 tc4424 (1/2 tc4425) 1 2 c l = 1800 pf input output v dd = 18v ceramic downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 11 tc4423/tc4424/tc4425 5.0 packaging information 5.1 package marking information xxxxxxxxxxxxxnnn yyww 8-lead pdip (300 mil) example: tc4423cpa256 0420 16-lead soic (300 mil) example: xxxxxxxxxxxxxxxxxxxxxx yywwnnn xxxxxxxxxxx 0420256 tc4423coe 8-lead dfn example : xxxxxxx xxxxxxx xxyyww nnn tc4423 emf 0420 256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 12 ? 2002-2012 microchip technology inc. 8-lead plastic dual flat no lead package (mf) 6x5 mm body (dfn-s) ? saw singulated note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 13 tc4423/tc4424/tc4425 8-lead plastic dual in-line (p) ? 300 mil (pdip) b1 b a1 a l a2 p ? e eb ? c e1 n d 1 2 units inches* millimeters dimension limits min nom max min nom max number of pins n 88 pitch p .100 2.54 top to seating plane a .140 .155 .170 3.56 3.94 4.32 molded package thickness a2 .115 .130 .145 2.92 3.30 3.68 base to seating plane a1 .015 0.38 shoulder to shoulder width e .300 .313 .325 7.62 7.94 8.26 molded package width e1 .240 .250 .260 6.10 6.35 6.60 overall length d .360 .373 .385 9.14 9.46 9.78 tip to seating plane l .125 .130 .135 3.18 3.30 3.43 lead thickness c .008 .012 .015 0.20 0.29 0.38 upper lead width b1 .045 .058 .070 1.14 1.46 1.78 lower lead width b .014 .018 .022 0.36 0.46 0.56 overall row spacing eb .310 .370 .430 7.87 9.40 10.92 mold draft angle top ? 5 10 15 5 10 15 mold draft angle bottom ? 5 10 15 5 10 15 * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not exceed jedec equivalent: ms-001 drawing no. c04-018 .010 (0.254mm) per side. significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 14 ? 2002-2012 microchip technology inc. 16-lead plastic small outline (so) ? wide, 300 mil (soic) foot angle ? 048048 15 12 0 15 12 0 ? mold draft angle bottom 15 12 0 15 12 0 ? mold draft angle top 0.51 0.42 0.36 .020 .017 .014 b lead width 0.33 0.28 0.23 .013 .011 .009 c lead thickness 1.27 0.84 0.41 .050 .033 .016 l foot length 0.74 0.50 0.25 .029 .020 .010 h chamfer distance 10.49 10.30 10.10 .413 .406 .398 d overall length 7.59 7.49 7.39 .299 .295 .291 e1 molded package width 10.67 10.34 10.01 .420 .407 .394 e overall width 0.30 0.20 0.10 .012 .008 .004 a1 standoff 2.39 2.31 2.24 .094 .091 .088 a2 molded package thickness 2.64 2.50 2.36 .104 .099 .093 a overall height 1.27 .050 p pitch 16 16 n number of pins max nom min max nom min dimension limits millimeters inches* units l ? c ? h 45 ? 1 2 d p n b e1 e ? a2 a1 a * controlling parameter notes: dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions s hall not exceed .010 (0.254mm) per side. jedec equivalent: ms-013 drawing no. c04-102 significant characteristic note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 15 tc4423/tc4424/tc4425 6.0 revision history revision e (december 2012) added a note to each package outline drawing. downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 16 ? 2002-2012 microchip technology inc. downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 17 tc4423/tc4424/tc4425 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . sales and support device: tc4423: 3a dual mosfet driver, inverting tc4424: 3a dual mosfet driver, non-inverting tc4425: 3a dual mosfet driver, complementary temperature range: c = 0c to +70c (pdip & soic only) e = -40c to +85c v = -40c to +125c package: mf = dual, flat, no-lead (6x5 mm body), 8-lead mf713 = dual, flat, no-lead (6x5 mm body), 8-lead (tape and reel) oe = soic (wide), 16-pin oe713 = soic (wide), 16-pin (tape and reel) pa = plastic dip, (300 mil body), 8-lead pb free: g = lead-free device * = blank * available on selected packages. contact your local sales representative for availability. examples: a) tc4423coe: 3a dual inverting mosfet driver, 0c to +70c, 16ld soic package. b) tc4423cpa: 3a dual inverting mosfet driver, 0c to +70c, 8ld pdip package . c) tc4423vmf: 3a dual inverting mosfet driver, -40c to +125c, 8ld dfn package . a) tc4424coe713: 3a dual non-inverting, mosfet driver, 0c to +70c, 16ld soic package, tape and reel. b) tc4424epa: 3a dual non-inverting, mosfet driver, -40c to +85c, 8ld pdip package. a) tc4425eoe: 3a dual complementary, mosfet driver, -40c to +85c, 16ld soic package . b) tc4425cpa: 3a dual complementary, mosfet driver, 0c to +70c, pdip package . part no. x xx package temperature range device xxx tape & reel x pb free data sheets products supported by a preliminary data sheet may have an errata sheet describing minor operational differences and recommended workarounds. to determine if an errata sheet exists for a particular device, please contact one of the following: 1. your local microchip sales office 2. the microchip worldwide site (www.microchip.com) please specify which device, revision of silicon and data sheet (include literature #) you are using. customer notification system register on our web site (www.microchip.com/cn) to receive the most current information on our products. downloaded from: http:///
tc4423/tc4424/tc4425 ds21421e-page 18 ? 2002-2012 microchip technology inc. notes: downloaded from: http:///
? 2002-2012 microchip technology inc. ds21421e-page 19 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2002-2012, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620767962 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
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